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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/cicc/LiewSKN23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Borivoje_Nikolic>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/David_Kehlet>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Farhana_Sheikh>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Harrison_Liew>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FCICC57935.2023.10121246>
foaf:homepage <https://doi.org/10.1109/CICC57935.2023.10121246>
dc:identifier DBLP conf/cicc/LiewSKN23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FCICC57935.2023.10121246 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Silicon Process Technology Constraints for Standardized Vertical Die-to-Die Interconnects. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Borivoje_Nikolic>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/David_Kehlet>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Farhana_Sheikh>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Harrison_Liew>
swrc:pages 1-6 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/cicc/2023>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/cicc/LiewSKN23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/cicc/LiewSKN23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/cicc/cicc2023.html#LiewSKN23>
rdfs:seeAlso <https://doi.org/10.1109/CICC57935.2023.10121246>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/cicc>
dc:title Silicon Process Technology Constraints for Standardized Vertical Die-to-Die Interconnects. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document