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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/cicc/SakuiO19>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Koji_Sakui>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Takayuki_Ohba>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FCICC.2019.8780385>
foaf:homepage <https://doi.org/10.1109/CICC.2019.8780385>
dc:identifier DBLP conf/cicc/SakuiO19 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FCICC.2019.8780385 (xsd:string)
dcterms:issued 2019 (xsd:gYear)
rdfs:label Three-dimensional Integration (3DI) with Bumpless Interconnects for Tera-scale Generation : High Speed, Low Power, and Ultra-small Operating Platform. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Koji_Sakui>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Takayuki_Ohba>
swrc:pages 1-6 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/cicc/2019>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/cicc/SakuiO19/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/cicc/SakuiO19>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/cicc/cicc2019.html#SakuiO19>
rdfs:seeAlso <https://doi.org/10.1109/CICC.2019.8780385>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/cicc>
dc:title Three-dimensional Integration (3DI) with Bumpless Interconnects for Tera-scale Generation : High Speed, Low Power, and Ultra-small Operating Platform. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document