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foaf:homepage <https://ieeexplore.ieee.org/xpl/conhome/7939939/proceeding>
dc:identifier DBLP conf/coolchips/2017 (xsd:string)
dc:identifier ISBN 978-1-5386-3828-6 (xsd:string)
swrc:isbn ISBN 978-1-5386-3828-6 (xsd:string)
dcterms:issued 2017 (xsd:gYear)
rdfs:label 2017 IEEE Symposium in Low-Power and High-Speed Chips, COOL Chips 2017, Yokohama, Japan, April 19-21, 2017 (xsd:string)
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dc:publisher IEEE Computer Society (xsd:string)
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swrc:series <https://dblp.l3s.de/d2r/resource/conferences/coolchips>
dcterms:tableOfContent <http://dblp.uni-trier.de/db/conf/coolchips/coolchips2017.html>
dc:title 2017 IEEE Symposium in Low-Power and High-Speed Chips, COOL Chips 2017, Yokohama, Japan, April 19-21, 2017 (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Collection>
rdf:type swrc:Proceedings
rdf:type foaf:Document