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foaf:homepage
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<https://ieeexplore.ieee.org/xpl/conhome/8713395/proceeding>
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dc:identifier
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DBLP conf/coolchips/2019
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dc:identifier
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ISBN 978-1-7281-1749-2
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swrc:isbn
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ISBN 978-1-7281-1749-2
(xsd:string)
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dcterms:issued
|
2019
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rdfs:label
|
IEEE Symposium in Low-Power and High-Speed Chips, COOL CHIPS 2019, Yokohama, Japan, April 17-19, 2019
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is
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<https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/GianelliINGT19>
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<https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/GollapudiYG19>
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<https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/ItsuboTM19>
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<https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/OgawaIIVCWSOG19>
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<https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/SasakiMMD19>
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<https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/TanakaYMH19>
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<https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/TokusashiMA19>
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IEEE
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owl:sameAs
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owl:sameAs
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rdfs:seeAlso
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<http://amazon.com/s/ref=nb_ss_gw?field-keywords=978-1-7281-1749-2>
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<https://ieeexplore.ieee.org/xpl/conhome/8713395/proceeding>
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swrc:series
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<https://dblp.l3s.de/d2r/resource/conferences/coolchips>
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<http://dblp.uni-trier.de/db/conf/coolchips/coolchips2019.html>
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dc:title
|
IEEE Symposium in Low-Power and High-Speed Chips, COOL CHIPS 2019, Yokohama, Japan, April 17-19, 2019
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