| Property | Value |
|---|
|
dcterms:bibliographicCitation
|
<http://dblp.uni-trier.de/rec/bibtex/conf/coolchips/2023>
|
|
foaf:homepage
|
<http://dx.doi.org/doi.org%2F10.1109%2FCOOLCHIPS57690.2023>
|
|
foaf:homepage
|
<https://doi.org/10.1109/COOLCHIPS57690.2023>
|
|
dc:identifier
|
DBLP conf/coolchips/2023
(xsd:string)
|
|
dc:identifier
|
DOI doi.org%2F10.1109%2FCOOLCHIPS57690.2023
(xsd:string)
|
|
dc:identifier
|
ISBN 979-8-3503-3201-8
(xsd:string)
|
|
swrc:isbn
|
ISBN 979-8-3503-3201-8
(xsd:string)
|
|
dcterms:issued
|
2023
(xsd:gYear)
|
|
rdfs:label
|
IEEE Symposium in Low-Power and High-Speed Chips, COOL CHIPS 2023, Tokyo, Japan, April 19-21, 2023
(xsd:string)
|
|
is
dcterms:partOf
of
|
<https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/HanRKKPY23>
|
|
is
dcterms:partOf
of
|
<https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/InoueOCYMK23>
|
|
is
dcterms:partOf
of
|
<https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/KaiserG23>
|
|
is
dcterms:partOf
of
|
<https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/KimKHKHCY23>
|
|
is
dcterms:partOf
of
|
<https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/KuboT23>
|
|
is
dcterms:partOf
of
|
<https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/OhkawaA23>
|
|
is
dcterms:partOf
of
|
<https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/OpasatianI23>
|
|
is
dcterms:partOf
of
|
<https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/QinWAN23>
|
|
is
dcterms:partOf
of
|
<https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/RazilovZMF23>
|
|
is
dcterms:partOf
of
|
<https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/SyafalniFISA23>
|
|
is
dcterms:partOf
of
|
<https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/YoonLKLKK23>
|
|
dc:publisher
|
IEEE
(xsd:string)
|
|
owl:sameAs
|
<http://bibsonomy.org/uri/bibtexkey/conf/coolchips/2023/dblp>
|
|
owl:sameAs
|
<http://dblp.rkbexplorer.com/id/conf/coolchips/2023>
|
|
owl:sameAs
|
<urn:isbn:979-8-3503-3201-8>
|
|
rdfs:seeAlso
|
<http://amazon.com/s/ref=nb_ss_gw?field-keywords=979-8-3503-3201-8>
|
|
rdfs:seeAlso
|
<https://doi.org/10.1109/COOLCHIPS57690.2023>
|
|
swrc:series
|
<https://dblp.l3s.de/d2r/resource/conferences/coolchips>
|
|
dcterms:tableOfContent
|
<http://dblp.uni-trier.de/db/conf/coolchips/coolchips2023.html>
|
|
dc:title
|
IEEE Symposium in Low-Power and High-Speed Chips, COOL CHIPS 2023, Tokyo, Japan, April 19-21, 2023
(xsd:string)
|
|
dc:type
|
<http://purl.org/dc/dcmitype/Collection>
|
|
rdf:type
|
swrc:Proceedings
|
|
rdf:type
|
foaf:Document
|
![[RDF data]](https://dblp.l3s.de/d2r/snorql/rdf_flyer.24.gif)