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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/coolchips/ChacinUHMOIMISK11>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Fumito_Imura>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hiroshi_Nakagawa>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hiroyuki_Uchida>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Katsuya_Kikuchi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Marco_Chacin>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Masahiro_Aoyagi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Michiya_Hagimoto>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Motohiro_Suzuki>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Rimon_Ikeno>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Takashi_Miyazaki>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Takeshi_Ohkawa>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yukoh_Matsumoto>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FCOOLCHIPS.2011.5890921>
foaf:homepage <https://doi.org/10.1109/COOLCHIPS.2011.5890921>
dc:identifier DBLP conf/coolchips/ChacinUHMOIMISK11 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FCOOLCHIPS.2011.5890921 (xsd:string)
dcterms:issued 2011 (xsd:gYear)
rdfs:label COOL interconnect low power interconnection technology for scalable 3D LSI design. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Fumito_Imura>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hiroshi_Nakagawa>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hiroyuki_Uchida>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Katsuya_Kikuchi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Marco_Chacin>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Masahiro_Aoyagi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Michiya_Hagimoto>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Motohiro_Suzuki>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Rimon_Ikeno>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Takashi_Miyazaki>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Takeshi_Ohkawa>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yukoh_Matsumoto>
swrc:pages 1-3 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/2011>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/coolchips/ChacinUHMOIMISK11/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/coolchips/ChacinUHMOIMISK11>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/coolchips/coolchips2011.html#ChacinUHMOIMISK11>
rdfs:seeAlso <https://doi.org/10.1109/COOLCHIPS.2011.5890921>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/coolchips>
dc:title COOL interconnect low power interconnection technology for scalable 3D LSI design. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document