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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/coolchips/OhkawaA23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Masahiro_Aoyagi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Takeshi_Ohkawa>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FCOOLCHIPS57690.2023.10122025>
foaf:homepage <https://doi.org/10.1109/COOLCHIPS57690.2023.10122025>
dc:identifier DBLP conf/coolchips/OhkawaA23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FCOOLCHIPS57690.2023.10122025 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label FPGA Emulation of Through-Silicon-Via (TSV) Dataflow Network for 3D Standard Chip Stacking System. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Masahiro_Aoyagi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Takeshi_Ohkawa>
swrc:pages 1-3 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/2023>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/coolchips/OhkawaA23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/coolchips/OhkawaA23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/coolchips/coolchips2023.html#OhkawaA23>
rdfs:seeAlso <https://doi.org/10.1109/COOLCHIPS57690.2023.10122025>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/coolchips>
dc:title FPGA Emulation of Through-Silicon-Via (TSV) Dataflow Network for 3D Standard Chip Stacking System. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document