3D-cool: Design and development of adaptive thermal-aware three-dimensional NoC-based multiprocessor chip.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/PangraciousDT18
Home
|
Example Publications
Property
Value
dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/conf/coolchips/PangraciousDT18
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Ashok_Kumar_Turuk
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Ranjitha_Dash
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Vinod_Pangracious
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FCoolChips.2018.8373074
>
foaf:
homepage
<
https://doi.org/10.1109/CoolChips.2018.8373074
>
dc:
identifier
DBLP conf/coolchips/PangraciousDT18
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FCoolChips.2018.8373074
(xsd:string)
dcterms:
issued
2018
(xsd:gYear)
rdfs:
label
3D-cool: Design and development of adaptive thermal-aware three-dimensional NoC-based multiprocessor chip.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Ashok_Kumar_Turuk
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Ranjitha_Dash
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Vinod_Pangracious
>
swrc:
pages
1-3
(xsd:string)
dcterms:
partOf
<
https://dblp.l3s.de/d2r/resource/publications/conf/coolchips/2018
>
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/conf/coolchips/PangraciousDT18/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/conf/coolchips/PangraciousDT18
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/conf/coolchips/coolchips2018.html#PangraciousDT18
>
rdfs:
seeAlso
<
https://doi.org/10.1109/CoolChips.2018.8373074
>
swrc:
series
<
https://dblp.l3s.de/d2r/resource/conferences/coolchips
>
dc:
title
3D-cool: Design and development of adaptive thermal-aware three-dimensional NoC-based multiprocessor chip.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:InProceedings
rdf:
type
foaf:Document