Physically justifiable die-level modeling of spatial variation in view of systematic across wafer variability.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/dac/ChengGSQH09
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2009
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Physically justifiable die-level modeling of spatial variation in view of systematic across wafer variability.
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SSTA, leakage analysis, process variaion, timing
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Physically justifiable die-level modeling of spatial variation in view of systematic across wafer variability.
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