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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/dac/FangWC09>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jia-Wei_Fang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Martin_D._F._Wong>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yao-Wen_Chang>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1145%2F1629911.1630002>
foaf:homepage <https://doi.org/10.1145/1629911.1630002>
dc:identifier DBLP conf/dac/FangWC09 (xsd:string)
dc:identifier DOI doi.org%2F10.1145%2F1629911.1630002 (xsd:string)
dcterms:issued 2009 (xsd:gYear)
rdfs:label Flip-chip routing with unified area-I/O pad assignments for package-board co-design. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jia-Wei_Fang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Martin_D._F._Wong>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yao-Wen_Chang>
swrc:pages 336-339 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/dac/2009>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/dac/FangWC09/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/dac/FangWC09>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/dac/dac2009.html#FangWC09>
rdfs:seeAlso <https://doi.org/10.1145/1629911.1630002>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/dac>
dc:subject detailed routing, global routing, physical design (xsd:string)
dc:title Flip-chip routing with unified area-I/O pad assignments for package-board co-design. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document