[RDF data]
Home | Example Publications
PropertyValue
dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/dac/FranzonDSLOTMLDBSO08>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ben_Shani>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Eun_Chu_Oh>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kurt_Obermiller>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Michael_B._Steer>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Paul_D._Franzon>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Samson_Melamed>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sonali_Luniya>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Stephen_Berkeley>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Steve_Lipa>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tad_Doxsee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Thorlindur_Thorolfsson>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/W._Rhett_Davis>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1145%2F1391469.1391642>
foaf:homepage <https://doi.org/10.1145/1391469.1391642>
dc:identifier DBLP conf/dac/FranzonDSLOTMLDBSO08 (xsd:string)
dc:identifier DOI doi.org%2F10.1145%2F1391469.1391642 (xsd:string)
dcterms:issued 2008 (xsd:gYear)
rdfs:label Design and CAD for 3D integrated circuits. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ben_Shani>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Eun_Chu_Oh>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kurt_Obermiller>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Michael_B._Steer>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Paul_D._Franzon>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Samson_Melamed>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sonali_Luniya>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Stephen_Berkeley>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Steve_Lipa>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tad_Doxsee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Thorlindur_Thorolfsson>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/W._Rhett_Davis>
swrc:pages 668-673 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/dac/2008>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/dac/FranzonDSLOTMLDBSO08/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/dac/FranzonDSLOTMLDBSO08>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/dac/dac2008.html#FranzonDSLOTMLDBSO08>
rdfs:seeAlso <https://doi.org/10.1145/1391469.1391642>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/dac>
dc:subject 3DIC, TSV, thermal modeling, through silicon via (xsd:string)
dc:title Design and CAD for 3D integrated circuits. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document