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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/dac/LiuSCKKL11>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chang_Liu_0034>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jonghyun_Cho>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Joohee_Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Joungho_Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sung_Kyu_Lim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Taigon_Song>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1145%2F2024724.2024900>
foaf:homepage <https://doi.org/10.1145/2024724.2024900>
dc:identifier DBLP conf/dac/LiuSCKKL11 (xsd:string)
dc:identifier DOI doi.org%2F10.1145%2F2024724.2024900 (xsd:string)
dcterms:issued 2011 (xsd:gYear)
rdfs:label Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chang_Liu_0034>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jonghyun_Cho>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Joohee_Kim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Joungho_Kim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sung_Kyu_Lim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Taigon_Song>
swrc:pages 783-788 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/dac/2011>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/dac/LiuSCKKL11/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/dac/LiuSCKKL11>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/dac/dac2011.html#LiuSCKKL11>
rdfs:seeAlso <https://doi.org/10.1145/2024724.2024900>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/dac>
dc:title Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document