A methodology for modeling the effects of systematic within-die interconnect and device variation on circuit performance.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/dac/MehrotraSBCVN00
Home
|
Example Publications
Property
Value
dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/conf/dac/MehrotraSBCVN00
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Anantha_P._Chandrakasan
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Duane_S._Boning
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Rakesh_Vallishayee
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Sani_R._Nassif
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Shiou_Lin_Sam
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Vikas_Mehrotra
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1145%2F337292.337370
>
foaf:
homepage
<
https://doi.org/10.1145/337292.337370
>
dc:
identifier
DBLP conf/dac/MehrotraSBCVN00
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1145%2F337292.337370
(xsd:string)
dcterms:
issued
2000
(xsd:gYear)
rdfs:
label
A methodology for modeling the effects of systematic within-die interconnect and device variation on circuit performance.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Anantha_P._Chandrakasan
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Duane_S._Boning
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Rakesh_Vallishayee
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Sani_R._Nassif
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Shiou_Lin_Sam
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Vikas_Mehrotra
>
swrc:
pages
172-175
(xsd:string)
dcterms:
partOf
<
https://dblp.l3s.de/d2r/resource/publications/conf/dac/2000
>
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/conf/dac/MehrotraSBCVN00/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/conf/dac/MehrotraSBCVN00
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/conf/dac/dac2000.html#MehrotraSBCVN00
>
rdfs:
seeAlso
<
https://doi.org/10.1145/337292.337370
>
swrc:
series
<
https://dblp.l3s.de/d2r/resource/conferences/dac
>
dc:
title
A methodology for modeling the effects of systematic within-die interconnect and device variation on circuit performance.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:InProceedings
rdf:
type
foaf:Document