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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/dac/RichKMRHYCM23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Anna_Kasperovich>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Dennis_Rich>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mohamadali_Malakoutian>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Robert_M._Radway>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Shiho_Hagiwara>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Srabanti_Chowdhury>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Subhasish_Mitra>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Takahide_Yoshikawa>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FDAC56929.2023.10247815>
foaf:homepage <https://doi.org/10.1109/DAC56929.2023.10247815>
dc:identifier DBLP conf/dac/RichKMRHYCM23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FDAC56929.2023.10247815 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Thermal Scaffolding for Ultra-Dense 3D Integrated Circuits. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Anna_Kasperovich>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Dennis_Rich>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mohamadali_Malakoutian>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Robert_M._Radway>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Shiho_Hagiwara>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Srabanti_Chowdhury>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Subhasish_Mitra>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Takahide_Yoshikawa>
swrc:pages 1-6 (xsd:string)
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rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/dac/dac2023.html#RichKMRHYCM23>
rdfs:seeAlso <https://doi.org/10.1109/DAC56929.2023.10247815>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/dac>
dc:title Thermal Scaffolding for Ultra-Dense 3D Integrated Circuits. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document