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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/dac/VannaIampikulZEKAGRL23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kevin_Rinebold>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lingjun_Zhu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mohanalingam_Kathaperumal>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Pruek_Vanna-Iampikul>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ram_Gupta>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ravi_Agarwal>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Serhat_Erdogan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sung_Kyu_Lim>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FDAC56929.2023.10247949>
foaf:homepage <https://doi.org/10.1109/DAC56929.2023.10247949>
dc:identifier DBLP conf/dac/VannaIampikulZEKAGRL23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FDAC56929.2023.10247949 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kevin_Rinebold>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lingjun_Zhu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mohanalingam_Kathaperumal>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Pruek_Vanna-Iampikul>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ram_Gupta>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ravi_Agarwal>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Serhat_Erdogan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sung_Kyu_Lim>
swrc:pages 1-6 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/dac/2023>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/dac/VannaIampikulZEKAGRL23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/dac/VannaIampikulZEKAGRL23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/dac/dac2023.html#VannaIampikulZEKAGRL23>
rdfs:seeAlso <https://doi.org/10.1109/DAC56929.2023.10247949>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/dac>
dc:title Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document