Cost-driven 3D integration with interconnect layers.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/dac/WuSDDXDL10
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dcterms:
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2010
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rdfs:
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Cost-driven 3D integration with interconnect layers.
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interconnect service layer, network-on-chip, three-dimensional integrated circuit
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Cost-driven 3D integration with interconnect layers.
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