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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/date/YangGZSD06>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Changyun_Zhu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Li_Shang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Robert_P._Dick>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yonghong_Yang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Zhenyu_%28Peter%29_Gu>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FDATE.2006.243742>
foaf:homepage <https://doi.org/10.1109/DATE.2006.243742>
dc:identifier DBLP conf/date/YangGZSD06 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FDATE.2006.243742 (xsd:string)
dcterms:issued 2006 (xsd:gYear)
rdfs:label Adaptive chip-package thermal analysis for synthesis and design. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Changyun_Zhu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Li_Shang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Robert_P._Dick>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yonghong_Yang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Zhenyu_%28Peter%29_Gu>
swrc:pages 844-849 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/date/2006p>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/date/YangGZSD06/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/date/YangGZSD06>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/date/date2006p.html#YangGZSD06>
rdfs:seeAlso <https://doi.org/10.1109/DATE.2006.243742>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/date>
dc:title Adaptive chip-package thermal analysis for synthesis and design. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document