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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/elinfocom/NohKLK24>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kee-Won_Kwon>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Seo-Yoon_Lee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Seung-Mo_Noh>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Seungkyu_Kim>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FICEIC61013.2024.10457196>
foaf:homepage <https://doi.org/10.1109/ICEIC61013.2024.10457196>
dc:identifier DBLP conf/elinfocom/NohKLK24 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FICEIC61013.2024.10457196 (xsd:string)
dcterms:issued 2024 (xsd:gYear)
rdfs:label A Highly-Sensitive and Compact Interconnect Delay Monitoring Circuit for 3-Dimensional System Packages. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kee-Won_Kwon>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Seo-Yoon_Lee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Seung-Mo_Noh>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Seungkyu_Kim>
swrc:pages 1-4 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/elinfocom/2024>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/elinfocom/NohKLK24/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/elinfocom/NohKLK24>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/elinfocom/iceic2024.html#NohKLK24>
rdfs:seeAlso <https://doi.org/10.1109/ICEIC61013.2024.10457196>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/elinfocom>
dc:title A Highly-Sensitive and Compact Interconnect Delay Monitoring Circuit for 3-Dimensional System Packages. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document