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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/embc/LeeSYS19>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ho_Jin_Lee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jong-Mo_Seo>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jungho_Yi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Min-Won_Seo>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FEMBC.2019.8857936>
foaf:homepage <https://doi.org/10.1109/EMBC.2019.8857936>
dc:identifier DBLP conf/embc/LeeSYS19 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FEMBC.2019.8857936 (xsd:string)
dcterms:issued 2019 (xsd:gYear)
rdfs:label Stretchability enhancement of electronics according to the surface patterns fabricated by thermal reflow process. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ho_Jin_Lee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jong-Mo_Seo>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jungho_Yi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Min-Won_Seo>
swrc:pages 1282-1285 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/embc/2019>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/embc/LeeSYS19/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/embc/LeeSYS19>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/embc/embc2019.html#LeeSYS19>
rdfs:seeAlso <https://doi.org/10.1109/EMBC.2019.8857936>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/embc>
dc:title Stretchability enhancement of electronics according to the surface patterns fabricated by thermal reflow process. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document