EMC performance analysis of a processor/memory system using PCB and Package-On-Package.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/emccompo/SicardBFZML15
Home
|
Example Publications
Property
Value
dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/conf/emccompo/SicardBFZML15
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Alexandre_Boyer
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/An_Zhou
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Etienne_Sicard
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Fr%E2%88%9A%C2%A9d%E2%88%9A%C2%A9ric_Lafon
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Nicolas_Marier
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Priscila_Fernandez-Lopez
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FEMCCompo.2015.7358364
>
foaf:
homepage
<
https://doi.org/10.1109/EMCCompo.2015.7358364
>
dc:
identifier
DBLP conf/emccompo/SicardBFZML15
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FEMCCompo.2015.7358364
(xsd:string)
dcterms:
issued
2015
(xsd:gYear)
rdfs:
label
EMC performance analysis of a processor/memory system using PCB and Package-On-Package.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Alexandre_Boyer
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/An_Zhou
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Etienne_Sicard
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Fr%E2%88%9A%C2%A9d%E2%88%9A%C2%A9ric_Lafon
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Nicolas_Marier
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Priscila_Fernandez-Lopez
>
swrc:
pages
238-243
(xsd:string)
dcterms:
partOf
<
https://dblp.l3s.de/d2r/resource/publications/conf/emccompo/2015
>
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/conf/emccompo/SicardBFZML15/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/conf/emccompo/SicardBFZML15
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/conf/emccompo/emccompo2015.html#SicardBFZML15
>
rdfs:
seeAlso
<
https://doi.org/10.1109/EMCCompo.2015.7358364
>
swrc:
series
<
https://dblp.l3s.de/d2r/resource/conferences/emccompo
>
dc:
title
EMC performance analysis of a processor/memory system using PCB and Package-On-Package.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:InProceedings
rdf:
type
foaf:Document