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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/emccompo/SicardWL13>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Etienne_Sicard>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jiancheng_Li>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jianfei_Wu>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FEMCCompo.2013.6735164>
foaf:homepage <https://doi.org/10.1109/EMCCompo.2013.6735164>
dc:identifier DBLP conf/emccompo/SicardWL13 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FEMCCompo.2013.6735164 (xsd:string)
dcterms:issued 2013 (xsd:gYear)
rdfs:label Signal integrity and EMC performance enhancement using 3D integrated circuits - A case study. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Etienne_Sicard>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jiancheng_Li>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jianfei_Wu>
swrc:pages 10-14 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/emccompo/2013>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/emccompo/SicardWL13/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/emccompo/SicardWL13>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/emccompo/emccompo2013.html#SicardWL13>
rdfs:seeAlso <https://doi.org/10.1109/EMCCompo.2013.6735164>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/emccompo>
dc:title Signal integrity and EMC performance enhancement using 3D integrated circuits - A case study. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document