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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/essderc/InacLWLFMCK17>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Andreas_Mai>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Fabio_Coccetti>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Grzegorz_Lupina>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Marco_Lisker>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Matthias_Wietstruck>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mehmet_Kaynak>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mesut_Inac>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mirko_Fraschke>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FESSDERC.2017.8066630>
foaf:homepage <https://doi.org/10.1109/ESSDERC.2017.8066630>
dc:identifier DBLP conf/essderc/InacLWLFMCK17 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FESSDERC.2017.8066630 (xsd:string)
dcterms:issued 2017 (xsd:gYear)
rdfs:label 200 mm Wafer level graphene transfer by wafer bonding technique. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Andreas_Mai>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Fabio_Coccetti>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Grzegorz_Lupina>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Marco_Lisker>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Matthias_Wietstruck>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mehmet_Kaynak>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mesut_Inac>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mirko_Fraschke>
swrc:pages 216-219 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/essderc/2017>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/essderc/InacLWLFMCK17/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/essderc/InacLWLFMCK17>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/essderc/essderc2017.html#InacLWLFMCK17>
rdfs:seeAlso <https://doi.org/10.1109/ESSDERC.2017.8066630>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/essderc>
dc:title 200 mm Wafer level graphene transfer by wafer bonding technique. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document