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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/ets/CuiXFH23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Changming_Cui>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Haitao_Fu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Junlin_Huang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tuanhui_Xu>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FETS56758.2023.10174179>
foaf:homepage <https://doi.org/10.1109/ETS56758.2023.10174179>
dc:identifier DBLP conf/ets/CuiXFH23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FETS56758.2023.10174179 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Physical-aware Interconnect Testing and Repairing of Chiplets. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Changming_Cui>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Haitao_Fu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Junlin_Huang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tuanhui_Xu>
swrc:pages 1-4 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/ets/2023>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/ets/CuiXFH23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/ets/CuiXFH23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/ets/ets2023.html#CuiXFH23>
rdfs:seeAlso <https://doi.org/10.1109/ETS56758.2023.10174179>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/ets>
dc:title Physical-aware Interconnect Testing and Repairing of Chiplets. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document