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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/glvlsi/AlamTT05>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Carl_V._Thompson>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Donald_E._Troxel>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Syed_M._Alam>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1145%2F1057661.1057670>
foaf:homepage <https://doi.org/10.1145/1057661.1057670>
dc:identifier DBLP conf/glvlsi/AlamTT05 (xsd:string)
dc:identifier DOI doi.org%2F10.1145%2F1057661.1057670 (xsd:string)
dcterms:issued 2005 (xsd:gYear)
rdfs:label Thermal aware cell-based full-chip electromigration reliability analysis. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Carl_V._Thompson>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Donald_E._Troxel>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Syed_M._Alam>
swrc:pages 26-31 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/glvlsi/2005>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/glvlsi/AlamTT05/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/glvlsi/AlamTT05>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/glvlsi/glvlsi2005.html#AlamTT05>
rdfs:seeAlso <https://doi.org/10.1145/1057661.1057670>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/glvlsi>
dc:subject IC thermal analysis, electromigration, full-chip reliability, reliability aware design, reliability characterization (xsd:string)
dc:title Thermal aware cell-based full-chip electromigration reliability analysis. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document