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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/glvlsi/NieuwoudtKM08>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Arthur_Nieuwoudt>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jamil_Kawa>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yehia_Massoud>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1145%2F1366110.1366148>
foaf:homepage <https://doi.org/10.1145/1366110.1366148>
dc:identifier DBLP conf/glvlsi/NieuwoudtKM08 (xsd:string)
dc:identifier DOI doi.org%2F10.1145%2F1366110.1366148 (xsd:string)
dcterms:issued 2008 (xsd:gYear)
rdfs:label Impact of dummy filling techniques on interconnect capacitance and planarization in nano-scale process technology. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Arthur_Nieuwoudt>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jamil_Kawa>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yehia_Massoud>
swrc:pages 151-154 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/glvlsi/2008>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/glvlsi/NieuwoudtKM08/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/glvlsi/NieuwoudtKM08>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/glvlsi/glvlsi2008.html#NieuwoudtKM08>
rdfs:seeAlso <https://doi.org/10.1145/1366110.1366148>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/glvlsi>
dc:subject design for manufacturability, dummy fill (xsd:string)
dc:title Impact of dummy filling techniques on interconnect capacitance and planarization in nano-scale process technology. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document