Investigation of Surface Integrity in the Case of Chemical Mechanical Polishing Silicon Wafer by Molecular Dynamics Simulation Method.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/icat/Han06
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2006
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Investigation of Surface Integrity in the Case of Chemical Mechanical Polishing Silicon Wafer by Molecular Dynamics Simulation Method.
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Chemical mechanical polishing, molecular dynamics, silicon wafer, vacancy, dislocation.
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Investigation of Surface Integrity in the Case of Chemical Mechanical Polishing Silicon Wafer by Molecular Dynamics Simulation Method.
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