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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/iccad/ChenCKMWY03>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Andrew_B._Kahng>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Bo_Yao>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chung-Kuan_Cheng>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hongyu_Chen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ion_I._Mandoiu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Qinke_Wang>
foaf:homepage <http://dx.doi.org/doi.ieeecomputersociety.org%2F10.1109%2FICCAD.2003.1257579>
foaf:homepage <https://doi.ieeecomputersociety.org/10.1109/ICCAD.2003.1257579>
dc:identifier DBLP conf/iccad/ChenCKMWY03 (xsd:string)
dc:identifier DOI doi.ieeecomputersociety.org%2F10.1109%2FICCAD.2003.1257579 (xsd:string)
dcterms:issued 2003 (xsd:gYear)
rdfs:label The Y-Architecture for On-Chip Interconnect: Analysis and Methodology. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Andrew_B._Kahng>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bo_Yao>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chung-Kuan_Cheng>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hongyu_Chen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ion_I._Mandoiu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Qinke_Wang>
swrc:pages 13-20 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/iccad/2003>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/iccad/ChenCKMWY03/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/iccad/ChenCKMWY03>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/iccad/iccad2003.html#ChenCKMWY03>
rdfs:seeAlso <https://doi.ieeecomputersociety.org/10.1109/ICCAD.2003.1257579>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/iccad>
dc:title The Y-Architecture for On-Chip Interconnect: Analysis and Methodology. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document