Invited Paper: Solving Fine-Grained Static 3DIC Thermal with ML Thermal Solver Enhanced with Decay Curve Characterization.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/iccad/HeCYKXLR23
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dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/conf/iccad/HeCYKXLR23
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Akhilesh_Kumar
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Haiyang_He
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Jie_Yang_0023
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Lang_Lin
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Norman_Chang
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Rishikesh_Ranade
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Wenbo_Xia
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FICCAD57390.2023.10323972
>
foaf:
homepage
<
https://doi.org/10.1109/ICCAD57390.2023.10323972
>
dc:
identifier
DBLP conf/iccad/HeCYKXLR23
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FICCAD57390.2023.10323972
(xsd:string)
dcterms:
issued
2023
(xsd:gYear)
rdfs:
label
Invited Paper: Solving Fine-Grained Static 3DIC Thermal with ML Thermal Solver Enhanced with Decay Curve Characterization.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Akhilesh_Kumar
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Haiyang_He
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Jie_Yang_0023
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Lang_Lin
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Norman_Chang
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Rishikesh_Ranade
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Wenbo_Xia
>
swrc:
pages
1-7
(xsd:string)
dcterms:
partOf
<
https://dblp.l3s.de/d2r/resource/publications/conf/iccad/2023
>
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/conf/iccad/HeCYKXLR23/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/conf/iccad/HeCYKXLR23
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/conf/iccad/iccad2023.html#HeCYKXLR23
>
rdfs:
seeAlso
<
https://doi.org/10.1109/ICCAD57390.2023.10323972
>
swrc:
series
<
https://dblp.l3s.de/d2r/resource/conferences/iccad
>
dc:
title
Invited Paper: Solving Fine-Grained Static 3DIC Thermal with ML Thermal Solver Enhanced with Decay Curve Characterization.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:InProceedings
rdf:
type
foaf:Document