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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/iccad/LiPAC04>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lawrence_T._Pileggi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mehdi_Asheghi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Peng_Li_0001>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Rajit_Chandra>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FICCAD.2004.1382594>
foaf:homepage <https://doi.org/10.1109/ICCAD.2004.1382594>
dc:identifier DBLP conf/iccad/LiPAC04 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FICCAD.2004.1382594 (xsd:string)
dcterms:issued 2004 (xsd:gYear)
rdfs:label Efficient full-chip thermal modeling and analysis. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lawrence_T._Pileggi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mehdi_Asheghi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Peng_Li_0001>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Rajit_Chandra>
swrc:pages 319-326 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/iccad/2004>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/iccad/LiPAC04/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/iccad/LiPAC04>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/iccad/iccad2004.html#LiPAC04>
rdfs:seeAlso <https://doi.org/10.1109/ICCAD.2004.1382594>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/iccad>
dc:title Efficient full-chip thermal modeling and analysis. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document