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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/iccad/LuoSCK05>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Charles_C._Chiang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jamil_Kawa>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jianfeng_Luo>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Qing_Su>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FICCAD.2005.1560053>
foaf:homepage <https://doi.org/10.1109/ICCAD.2005.1560053>
dc:identifier DBLP conf/iccad/LuoSCK05 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FICCAD.2005.1560053 (xsd:string)
dcterms:issued 2005 (xsd:gYear)
rdfs:label A layout dependent full-chip copper electroplating topography model. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Charles_C._Chiang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jamil_Kawa>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jianfeng_Luo>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Qing_Su>
swrc:pages 133-140 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/iccad/2005>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/iccad/LuoSCK05/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/iccad/LuoSCK05>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/iccad/iccad2005.html#LuoSCK05>
rdfs:seeAlso <https://doi.org/10.1109/ICCAD.2005.1560053>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/iccad>
dc:title A layout dependent full-chip copper electroplating topography model. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document