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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/iccd/ChaoW95>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/D._F._Wong_0001>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kai-Yuan_Chao>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FICCD.1995.528813>
foaf:homepage <https://doi.org/10.1109/ICCD.1995.528813>
dc:identifier DBLP conf/iccd/ChaoW95 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FICCD.1995.528813 (xsd:string)
dcterms:issued 1995 (xsd:gYear)
rdfs:label Thermal placement for high-performance multichip modules. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/D._F._Wong_0001>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kai-Yuan_Chao>
swrc:pages 218-223 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/iccd/1995>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/iccd/ChaoW95/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/iccd/ChaoW95>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/iccd/iccd1995.html#ChaoW95>
rdfs:seeAlso <https://doi.org/10.1109/ICCD.1995.528813>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/iccd>
dc:subject multichip modules; circuit analysis computing; cooling; convection; thermal placement; high-performance multichip modules; electrical performance requirements; thermal behavior; thermal models; high-speed chips; multichip module packages; cooling environments; conduction cooling; convection cooling; chip junction temperatures (xsd:string)
dc:title Thermal placement for high-performance multichip modules. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document