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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/iccd/KahngKLL07>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Andrew_B._Kahng>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Bao_Liu_0001>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sung-Mo_Kang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Wei_Li>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FICCD.2007.4601882>
foaf:homepage <https://doi.org/10.1109/ICCD.2007.4601882>
dc:identifier DBLP conf/iccd/KahngKLL07 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FICCD.2007.4601882 (xsd:string)
dcterms:issued 2007 (xsd:gYear)
rdfs:label Analytical thermal placement for VLSI lifetime improvement and minimum performance variation. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Andrew_B._Kahng>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bao_Liu_0001>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sung-Mo_Kang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Wei_Li>
swrc:pages 71-77 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/iccd/2007>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/iccd/KahngKLL07/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/iccd/KahngKLL07>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/iccd/iccd2007.html#KahngKLL07>
rdfs:seeAlso <https://doi.org/10.1109/ICCD.2007.4601882>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/iccd>
dc:title Analytical thermal placement for VLSI lifetime improvement and minimum performance variation. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document