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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/iccd/KimCRDTSML20>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hakki_Mert_Torun>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jinwoo_Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Madhavan_Swaminathan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Majid_Ahadi_Dolatsara>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Nael_Mizanur_Rahman>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Saibal_Mukhopadhyay>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sung_Kyu_Lim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Venkata_Chaitanya_Krishna_Chekuri>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FICCD50377.2020.00030>
foaf:homepage <https://doi.org/10.1109/ICCD50377.2020.00030>
dc:identifier DBLP conf/iccd/KimCRDTSML20 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FICCD50377.2020.00030 (xsd:string)
dcterms:issued 2020 (xsd:gYear)
rdfs:label Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hakki_Mert_Torun>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jinwoo_Kim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Madhavan_Swaminathan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Majid_Ahadi_Dolatsara>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Nael_Mizanur_Rahman>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Saibal_Mukhopadhyay>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sung_Kyu_Lim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Venkata_Chaitanya_Krishna_Chekuri>
swrc:pages 80-87 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/iccd/2020>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/iccd/KimCRDTSML20/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/iccd/KimCRDTSML20>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/iccd/iccd2020.html#KimCRDTSML20>
rdfs:seeAlso <https://doi.org/10.1109/ICCD50377.2020.00030>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/iccd>
dc:title Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document