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dc:creator <https://dblp.l3s.de/d2r/resource/authors/B._Blampey>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/B._Martineau>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Y._Morandini>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FICECS202256217.2022.9970935>
foaf:homepage <https://doi.org/10.1109/ICECS202256217.2022.9970935>
dc:identifier DBLP conf/icecsys/MartineauBDBM22 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FICECS202256217.2022.9970935 (xsd:string)
dcterms:issued 2022 (xsd:gYear)
rdfs:label CMOS FD-SOI Technologies Ruggedness for Millimeter Wave Power Amplifier Design. (xsd:string)
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foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Y._Morandini>
swrc:pages 1-4 (xsd:string)
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dc:title CMOS FD-SOI Technologies Ruggedness for Millimeter Wave Power Amplifier Design. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document