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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/icicdt/GuoPIECWMGCRBJV12>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/A._Jourdan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Abdelkarim_Mercha>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Andrej_Ivankovic>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Antonio_La_Manna>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Augusto_Redolfi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Bart_De_Wachter>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Bart_Swinnen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Bart_Vandevelde>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Eric_Beyne>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Geert_Eneman>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Geert_Van_der_Plas>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Gerald_Beyer>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ingrid_De_Wolf>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kenneth_J._Rebibis>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mario_Gonzalez>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Thibault_Buisson>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Vladimir_Cherman>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Wei_Guo>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yann_Civale>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FICICDT.2012.6232855>
foaf:homepage <https://doi.org/10.1109/ICICDT.2012.6232855>
dc:identifier DBLP conf/icicdt/GuoPIECWMGCRBJV12 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FICICDT.2012.6232855 (xsd:string)
dcterms:issued 2012 (xsd:gYear)
rdfs:label 3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and őľ-bumps. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/A._Jourdan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Abdelkarim_Mercha>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Andrej_Ivankovic>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Antonio_La_Manna>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Augusto_Redolfi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bart_De_Wachter>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bart_Swinnen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bart_Vandevelde>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Eric_Beyne>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Geert_Eneman>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Geert_Van_der_Plas>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Gerald_Beyer>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ingrid_De_Wolf>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kenneth_J._Rebibis>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mario_Gonzalez>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Thibault_Buisson>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Vladimir_Cherman>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Wei_Guo>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yann_Civale>
swrc:pages 1-4 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/icicdt/2012>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/icicdt/GuoPIECWMGCRBJV12/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/icicdt/GuoPIECWMGCRBJV12>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/icicdt/icicdt2012.html#GuoPIECWMGCRBJV12>
rdfs:seeAlso <https://doi.org/10.1109/ICICDT.2012.6232855>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/icicdt>
dc:title 3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and őľ-bumps. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document