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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/icicdt/VianelloTHOCTDO13>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Barbara_De_Salvo>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Boubacar_Traore>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Elisa_Vianello>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Eric_Jalaguier>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Gabriel_Molas>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Houcine_Oucheikh>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/J.-F._Nodin>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Luca_Perniola>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/M._Harrand>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Olivier_Thomas>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Philippe_Blaise>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Santhosh_Onkaraiah>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/T._Cabout>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/T._Diokh>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FICICDT.2013.6563344>
foaf:homepage <https://doi.org/10.1109/ICICDT.2013.6563344>
dc:identifier DBLP conf/icicdt/VianelloTHOCTDO13 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FICICDT.2013.6563344 (xsd:string)
dcterms:issued 2013 (xsd:gYear)
rdfs:label Back-end 3D integration of HfO2-based RRAMs for low-voltage advanced IC digital design. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Barbara_De_Salvo>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Boubacar_Traore>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Elisa_Vianello>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Eric_Jalaguier>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Gabriel_Molas>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Houcine_Oucheikh>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/J.-F._Nodin>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Luca_Perniola>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/M._Harrand>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Olivier_Thomas>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Philippe_Blaise>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Santhosh_Onkaraiah>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/T._Cabout>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/T._Diokh>
swrc:pages 235-238 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/icicdt/2013>
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rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/icicdt/icicdt2013.html#VianelloTHOCTDO13>
rdfs:seeAlso <https://doi.org/10.1109/ICICDT.2013.6563344>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/icicdt>
dc:title Back-end 3D integration of HfO2-based RRAMs for low-voltage advanced IC digital design. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document