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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/icira/WangWY08>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yuhui_Wang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Zhengjia_Wang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Zhouping_Yin>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1007%2F978-3-540-88518-4%5F96>
foaf:homepage <https://doi.org/10.1007/978-3-540-88518-4_96>
dc:identifier DBLP conf/icira/WangWY08 (xsd:string)
dc:identifier DOI doi.org%2F10.1007%2F978-3-540-88518-4%5F96 (xsd:string)
dcterms:issued 2008 (xsd:gYear)
rdfs:label A Multi-physics Simulation Based Parameters Optimization for Anisotropic Conductive Adhesive Interconnection in Electronic Packaging. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yuhui_Wang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Zhengjia_Wang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Zhouping_Yin>
swrc:pages 896-905 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/icira/2008-2>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/icira/WangWY08/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/icira/WangWY08>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/icira/icira2008-2.html#WangWY08>
rdfs:seeAlso <https://doi.org/10.1007/978-3-540-88518-4_96>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/icira>
dc:subject Anisotropic conductive adhesive (ACA); reliability; coupled field; multi-physics simulation; optimization (xsd:string)
dc:title A Multi-physics Simulation Based Parameters Optimization for Anisotropic Conductive Adhesive Interconnection in Electronic Packaging. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document