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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/icmens/NaKLKLC06>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Eunsung_Lee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hyeon_Cheol_Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Il-hwan_Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kukjin_Chun>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kyounghwan_Na>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yong-Hwan_Lee>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FICMENS.2006.348211>
foaf:homepage <https://doi.org/10.1109/ICMENS.2006.348211>
dc:identifier DBLP conf/icmens/NaKLKLC06 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FICMENS.2006.348211 (xsd:string)
dcterms:issued 2006 (xsd:gYear)
rdfs:label Wafer Level Package Using Polymer Bonding of Thick SU-8 Photoresist. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Eunsung_Lee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hyeon_Cheol_Kim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Il-hwan_Kim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kukjin_Chun>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kyounghwan_Na>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yong-Hwan_Lee>
swrc:pages 31-34 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/icmens/2006>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/icmens/NaKLKLC06/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/icmens/NaKLKLC06>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/icmens/icmens2006.html#NaKLKLC06>
rdfs:seeAlso <https://doi.org/10.1109/ICMENS.2006.348211>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/icmens>
dc:title Wafer Level Package Using Polymer Bonding of Thick SU-8 Photoresist. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document