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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/icsenst/VJD23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Abhishek_DN>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kiran_Kumar_B._V.>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Pradyumna_J.>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FICST59744.2023.10460770>
foaf:homepage <https://doi.org/10.1109/ICST59744.2023.10460770>
dc:identifier DBLP conf/icsenst/VJD23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FICST59744.2023.10460770 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Novel Method of Hermetic Sealing of Electronics Package by Electron Beam Welding. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Abhishek_DN>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kiran_Kumar_B._V.>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Pradyumna_J.>
swrc:pages 1-6 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/icsenst/2023>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/icsenst/VJD23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/icsenst/VJD23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/icsenst/icst2023.html#VJD23>
rdfs:seeAlso <https://doi.org/10.1109/ICST59744.2023.10460770>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/icsenst>
dc:title Novel Method of Hermetic Sealing of Electronics Package by Electron Beam Welding. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document