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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/icta3/WuWW21>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jun_Wang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lei_Wang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Luchao_Wu>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FICTA53157.2021.9661599>
foaf:homepage <https://doi.org/10.1109/ICTA53157.2021.9661599>
dc:identifier DBLP conf/icta3/WuWW21 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FICTA53157.2021.9661599 (xsd:string)
dcterms:issued 2021 (xsd:gYear)
rdfs:label Measuring the fracture toughness of low-k thin films used in advanced packaging. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jun_Wang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lei_Wang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Luchao_Wu>
swrc:pages 131-132 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/icta3/2021>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/icta3/WuWW21/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/icta3/WuWW21>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/icta3/icta2021.html#WuWW21>
rdfs:seeAlso <https://doi.org/10.1109/ICTA53157.2021.9661599>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/icta3>
dc:title Measuring the fracture toughness of low-k thin films used in advanced packaging. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document