Finite Element Method for System-in-Package (SiP) Technology: Thermal Analysis Using Chip Cooling Laminate Chip (CCLC).
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/icuimc/OukairaSZL23
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dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/conf/icuimc/OukairaSZL23
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Ahmed_Lakhssassi
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Aziz_Oukaira
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Dhaou_Said
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Jamal_Zbitou
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FIMCOM56909.2023.10035652
>
foaf:
homepage
<
https://doi.org/10.1109/IMCOM56909.2023.10035652
>
dc:
identifier
DBLP conf/icuimc/OukairaSZL23
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FIMCOM56909.2023.10035652
(xsd:string)
dcterms:
issued
2023
(xsd:gYear)
rdfs:
label
Finite Element Method for System-in-Package (SiP) Technology: Thermal Analysis Using Chip Cooling Laminate Chip (CCLC).
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Ahmed_Lakhssassi
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Aziz_Oukaira
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Dhaou_Said
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Jamal_Zbitou
>
swrc:
pages
1-5
(xsd:string)
dcterms:
partOf
<
https://dblp.l3s.de/d2r/resource/publications/conf/icuimc/2023
>
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/conf/icuimc/OukairaSZL23/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/conf/icuimc/OukairaSZL23
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/conf/icuimc/imcom2023.html#OukairaSZL23
>
rdfs:
seeAlso
<
https://doi.org/10.1109/IMCOM56909.2023.10035652
>
swrc:
series
<
https://dblp.l3s.de/d2r/resource/conferences/icuimc
>
dc:
title
Finite Element Method for System-in-Package (SiP) Technology: Thermal Analysis Using Chip Cooling Laminate Chip (CCLC).
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:InProceedings
rdf:
type
foaf:Document