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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/icuimc/OukairaSZL23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ahmed_Lakhssassi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Aziz_Oukaira>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Dhaou_Said>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jamal_Zbitou>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FIMCOM56909.2023.10035652>
foaf:homepage <https://doi.org/10.1109/IMCOM56909.2023.10035652>
dc:identifier DBLP conf/icuimc/OukairaSZL23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FIMCOM56909.2023.10035652 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Finite Element Method for System-in-Package (SiP) Technology: Thermal Analysis Using Chip Cooling Laminate Chip (CCLC). (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ahmed_Lakhssassi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Aziz_Oukaira>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Dhaou_Said>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jamal_Zbitou>
swrc:pages 1-5 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/icuimc/2023>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/icuimc/OukairaSZL23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/icuimc/OukairaSZL23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/icuimc/imcom2023.html#OukairaSZL23>
rdfs:seeAlso <https://doi.org/10.1109/IMCOM56909.2023.10035652>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/icuimc>
dc:title Finite Element Method for System-in-Package (SiP) Technology: Thermal Analysis Using Chip Cooling Laminate Chip (CCLC). (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document