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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/iecon/BuscaTBHA13>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Cristian_Busca>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Frede_Blaabjerg>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lars_Helle>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Remus_Teodorescu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tusitha_Abeyasekera>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FIECON.2013.6699216>
foaf:homepage <https://doi.org/10.1109/IECON.2013.6699216>
dc:identifier DBLP conf/iecon/BuscaTBHA13 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FIECON.2013.6699216 (xsd:string)
dcterms:issued 2013 (xsd:gYear)
rdfs:label Dynamic thermal modelling and analysis of press-pack IGBTs both at component-level and chip-level. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Cristian_Busca>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Frede_Blaabjerg>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lars_Helle>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Remus_Teodorescu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tusitha_Abeyasekera>
swrc:pages 677-682 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/iecon/2013>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/iecon/BuscaTBHA13/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/iecon/BuscaTBHA13>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/iecon/iecon2013.html#BuscaTBHA13>
rdfs:seeAlso <https://doi.org/10.1109/IECON.2013.6699216>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/iecon>
dc:title Dynamic thermal modelling and analysis of press-pack IGBTs both at component-level and chip-level. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document