[RDF data]
Home | Example Publications
PropertyValue
dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/ieeesensors/StoukatchADDRF20>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Denis_Flandre>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Fran%E2%88%9A%C3%9Fois_Dupont>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jean-Michel_Redout%E2%88%9A%C2%A9>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Nicolas_Andr%E2%88%9A%C2%A9>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Serguei_Stoukatch>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Thibault_P._Delhaye>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FSENSORS47125.2020.9278669>
foaf:homepage <https://doi.org/10.1109/SENSORS47125.2020.9278669>
dc:identifier DBLP conf/ieeesensors/StoukatchADDRF20 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FSENSORS47125.2020.9278669 (xsd:string)
dcterms:issued 2020 (xsd:gYear)
rdfs:label Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Denis_Flandre>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Fran%E2%88%9A%C3%9Fois_Dupont>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jean-Michel_Redout%E2%88%9A%C2%A9>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Nicolas_Andr%E2%88%9A%C2%A9>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Serguei_Stoukatch>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Thibault_P._Delhaye>
swrc:pages 1-4 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/ieeesensors/2020>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/ieeesensors/StoukatchADDRF20/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/ieeesensors/StoukatchADDRF20>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/ieeesensors/ieeesensors2020.html#StoukatchADDRF20>
rdfs:seeAlso <https://doi.org/10.1109/SENSORS47125.2020.9278669>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/ieeesensors>
dc:title Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document