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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/ifip5-5/BeckertBET08>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Andreas_T%E2%88%9A%C4%BEnnermann>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Erik_Beckert>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ramona_Eberhardt>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Thomas_Burkhardt>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1007%2F978-0-387-77405-3%5F13>
foaf:homepage <https://doi.org/10.1007/978-0-387-77405-3_13>
dc:identifier DBLP conf/ifip5-5/BeckertBET08 (xsd:string)
dc:identifier DOI doi.org%2F10.1007%2F978-0-387-77405-3%5F13 (xsd:string)
dcterms:issued 2008 (xsd:gYear)
rdfs:label Solder Bumping - A Flexible Joining Approach for the Precision Assembly of Optoelectronical Systems. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Andreas_T%E2%88%9A%C4%BEnnermann>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Erik_Beckert>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ramona_Eberhardt>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Thomas_Burkhardt>
swrc:pages 139-147 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/ifip5-5/2008ipas>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/ifip5-5/BeckertBET08/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/ifip5-5/BeckertBET08>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/ifip5-5/ipas2008.html#BeckertBET08>
rdfs:seeAlso <https://doi.org/10.1007/978-0-387-77405-3_13>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/ifip5-5>
dc:subject optics; microassembly; laser beam soldering; bumping; jetting (xsd:string)
dc:title Solder Bumping - A Flexible Joining Approach for the Precision Assembly of Optoelectronical Systems. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document