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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/imw2/SpessotSERXBLCB22>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Alessio_Spessot>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Elena_Capogreco>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Eugenio_Dentoni_Litta>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Joao_Bastos>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Naoto_Horiguchi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Rahul_Budhwani>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ricardo_Escobar>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Romain_Ritzenthaler>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Shairfe_Muhammad_Salahuddin>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yang_Xiang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yangyin_Chen>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FIMW52921.2022.9779308>
foaf:homepage <https://doi.org/10.1109/IMW52921.2022.9779308>
dc:identifier DBLP conf/imw2/SpessotSERXBLCB22 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FIMW52921.2022.9779308 (xsd:string)
dcterms:issued 2022 (xsd:gYear)
rdfs:label Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Alessio_Spessot>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Elena_Capogreco>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Eugenio_Dentoni_Litta>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Joao_Bastos>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Naoto_Horiguchi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Rahul_Budhwani>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ricardo_Escobar>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Romain_Ritzenthaler>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Shairfe_Muhammad_Salahuddin>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yang_Xiang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yangyin_Chen>
swrc:pages 1-4 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/imw2/2022>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/imw2/SpessotSERXBLCB22/dblp>
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rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/imw2/imw2022.html#SpessotSERXBLCB22>
rdfs:seeAlso <https://doi.org/10.1109/IMW52921.2022.9779308>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/imw2>
dc:title Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document