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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/iros/PopaMMSS06>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Dan_O._Popa>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Harry_E._Stephanou>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jeongsik_Sin>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Manoj_Mitta>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Rakesh_Murthy>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FIROS.2006.281751>
foaf:homepage <https://doi.org/10.1109/IROS.2006.281751>
dc:identifier DBLP conf/iros/PopaMMSS06 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FIROS.2006.281751 (xsd:string)
dcterms:issued 2006 (xsd:gYear)
rdfs:label M3-Modular Multi-Scale Assembly System for MEMS Packaging. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Dan_O._Popa>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Harry_E._Stephanou>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jeongsik_Sin>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Manoj_Mitta>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Rakesh_Murthy>
swrc:pages 3712-3717 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/iros/2006>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/iros/PopaMMSS06/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/iros/PopaMMSS06>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/iros/iros2006.html#PopaMMSS06>
rdfs:seeAlso <https://doi.org/10.1109/IROS.2006.281751>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/iros>
dc:title M3-Modular Multi-Scale Assembly System for MEMS Packaging. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document