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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/irps/BenderBB23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Duane_S._Boning>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Emmanuel_Bender>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Joseph_B._Bernstein>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FIRPS48203.2023.10117980>
foaf:homepage <https://doi.org/10.1109/IRPS48203.2023.10117980>
dc:identifier DBLP conf/irps/BenderBB23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FIRPS48203.2023.10117980 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label The Effects of Process Variations and BTI in Packaged FinFET Devices. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Duane_S._Boning>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Emmanuel_Bender>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Joseph_B._Bernstein>
swrc:pages 1-5 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/irps/2023>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/irps/BenderBB23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/irps/BenderBB23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/irps/irps2023.html#BenderBB23>
rdfs:seeAlso <https://doi.org/10.1109/IRPS48203.2023.10117980>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/irps>
dc:title The Effects of Process Variations and BTI in Packaged FinFET Devices. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document