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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/irps/DingPLZCFWC23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hosain_Farr>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Houman_Zahedmanesh>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ingrid_De_Wolf>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kris_Croes>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Melina_Lofrano>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/O._Varela_Pedreira>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/T._Chavez>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Youqi_Ding>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FIRPS48203.2023.10117870>
foaf:homepage <https://doi.org/10.1109/IRPS48203.2023.10117870>
dc:identifier DBLP conf/irps/DingPLZCFWC23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FIRPS48203.2023.10117870 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hosain_Farr>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Houman_Zahedmanesh>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ingrid_De_Wolf>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kris_Croes>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Melina_Lofrano>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/O._Varela_Pedreira>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/T._Chavez>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Youqi_Ding>
swrc:pages 1-7 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/irps/2023>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/irps/DingPLZCFWC23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/irps/DingPLZCFWC23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/irps/irps2023.html#DingPLZCFWC23>
rdfs:seeAlso <https://doi.org/10.1109/IRPS48203.2023.10117870>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/irps>
dc:title Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document