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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/irps/DudashMBCOMKWB23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Bjoern_Boehme>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Frank_Kuechenmeister>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jungtae_Ok>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Karlheinz_Bock>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Karsten_Meier>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kashi_Vishwanath_Machani>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Marcel_Wieland>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Simone_Capecchi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Viktor_Dudash>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FIRPS48203.2023.10117636>
foaf:homepage <https://doi.org/10.1109/IRPS48203.2023.10117636>
dc:identifier DBLP conf/irps/DudashMBCOMKWB23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FIRPS48203.2023.10117636 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bjoern_Boehme>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Frank_Kuechenmeister>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jungtae_Ok>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Karlheinz_Bock>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Karsten_Meier>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kashi_Vishwanath_Machani>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Marcel_Wieland>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Simone_Capecchi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Viktor_Dudash>
swrc:pages 1-6 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/irps/2023>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/irps/DudashMBCOMKWB23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/irps/DudashMBCOMKWB23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/irps/irps2023.html#DudashMBCOMKWB23>
rdfs:seeAlso <https://doi.org/10.1109/IRPS48203.2023.10117636>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/irps>
dc:title Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document