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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/irps/HaLBLKWLLP23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/B._W._Woo>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/D._S._Lee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/G._H._Bae>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/N.-H._Lee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/S._H._Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/S._Lee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/S._Pae>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sungmock_Ha>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Y._S._Lee>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FIRPS48203.2023.10118277>
foaf:homepage <https://doi.org/10.1109/IRPS48203.2023.10118277>
dc:identifier DBLP conf/irps/HaLBLKWLLP23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FIRPS48203.2023.10118277 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Reliability Characterization of HBM featuring $\text{HK}+\text{MG}$ Logic Chip with Multi-stacked DRAMs. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/B._W._Woo>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/D._S._Lee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/G._H._Bae>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/N.-H._Lee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/S._H._Kim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/S._Lee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/S._Pae>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sungmock_Ha>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Y._S._Lee>
swrc:pages 1-7 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/irps/2023>
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owl:sameAs <http://dblp.rkbexplorer.com/id/conf/irps/HaLBLKWLLP23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/irps/irps2023.html#HaLBLKWLLP23>
rdfs:seeAlso <https://doi.org/10.1109/IRPS48203.2023.10118277>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/irps>
dc:title Reliability Characterization of HBM featuring $\text{HK}+\text{MG}$ Logic Chip with Multi-stacked DRAMs. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document